CMP 化学品& 玻璃浆计量

化学机械平坦化（CMP）是指精确抛光设备利用精细玻璃浆对晶片表面进行平整化的过程，好的平整的效果能够提高精密光刻水平。CMP技术也用于控制薄膜厚度及剥离隔离层。弗洛德计量泵不仅被用作玻璃浆化学进程控制，而且用于保持CMP过程中玻璃浆的机械性能。

Chemical Mechanical Planarization (CMP) is the process during which precision polishing machines use a fine ceramic slurry to make wafer surfaces as flat ( planar ) as possible, ensuring the best resolution for the micro-lithography steps to follow. The CMP process is also used to control film thickness and removal of barrier layers. Fluid Metering pumps are used for both the chemical formulation of the slurry, as well as maintaining the mechanical properties of the slurry during the planarization.

CMP过程后清洁工序 / Post CMP Cleaning
铵基氢氧化物添加剂

CMP过程完成后，在晶片的微小几何结构中会有少量残留玻璃浆存在。因此，在CMP过程后需要用铵基氢氧化物冲洗去除残留颗粒，为下一步的光刻做准备。在晶片生产过程中，因为氧化物及金属浆液会有多层堆积，CMP及后CMP清洁过程需要重复多次。随着微几何结构变小，晶片的直径变大。CMP过程的重要性使得在生产中需要非常多的弗洛德无阀计量泵。

Ammonium Hydroxide addition :
Following the CMP polishing process, there is a small amount of residual slurry material which remains within the micro geometries on the wafer. A special process, Post CMP Cleaning uses an Ammonium Hydroxide wash to remove all remaining particles, preparing the wafer for additional photo-lithography processing.During the wafer manufacturing process, the CMP and Post CMP Cleaning processes will be repeated many times, as layers of oxide and metal are deposited on the surface of the preceding layer. As micro geometries get smaller, and wafer diameters get larger, the importance of planarization process control will continue to increase dramatically the requirement for Fluid Metering's Valveless CeramPump.

过氧化氢添加剂 / Hydrogen Peroxide addition.
CMP混合浆液通常储存在批处理容器中，该浆液通常由磨损性陶瓷颗粒及氧化剂混合而成，常用的氧化剂是过氧化氢。弗洛德QV & RHV变速泵通常被选择用于精确添加过氧化氢到浆液容器，原因是它们具有无漂移的精确性，化学稳定性以及长时间免维护的特点。系统中加入的过氧化氢比例会影响到浆液的化学性（过氧化氢集中度）及机械性能（颗粒密度）。

The CMP slurry mixture is typically prepared in a batch vessel, and is a mixture of abrasive ceramic particles and an oxidation agent, usually hydrogen peroxide.

Fluid Metering QV & RHV Variable Speed Pumps have been selected for precise addition of hydrogen peroxide into the slurry tank because of their drift free accuracy, chemical inertness, and long term maintenance-free operation. The amount of hydrogen peroxide added to the system affects both the chemical (peroxide concentration) and mechanical (particle density) properties of the slurry.

氢氟酸计量泵 / Hydrofloric Acid Metering Pumps
在电子工业中，最难控制的介质之一就是氢氟酸（HF)。氢氟酸在晶片制造过程中不仅用作强力清洁剂，而且还用作二氧化硅蚀刻剂。其强烈的腐蚀性使得其非常难以控制，因为它对金属和陶瓷都有很强的腐蚀性。弗洛德无阀氢氟酸计量泵采用耐氢氟酸的材料Techtron PPS 及Teflon材料制作，以保证其免维护计量的性能。

One of the most difficult chemicals to handle in the semicon industry is Hydrofloric Acid, commonly refered to as HF. It is used throught the wafer manufacturing process primarily as an aggressive cleaning agent, as well as a metal and silicon oxide etching agent. It's aggressive chemical nature makes it extremely difficult to handle, and chemically destructive to metals and ceramics.

Fluid Metering's new valveless HF Metering Pump is manufactured of chemically inert Techtron PPS® and Teflon® materials for maintenance-free precision metering applications.

浆液容器湿度 / Slurry tank humidification
一旦浆液混合完成，保持浆液化学性就非常重要。容器中的再循环及混合系统确保玻璃浆的同质化，而容器内的氮气保护层则使得浆液免受空气污染而变质。然而，氮气保护层有使得浆液表面及容器内壁浆液干燥的趋势。如果不采用精确加湿系统，玻璃浆会粘结形成大的颗粒，CMP过程中颗粒会对晶片表面造成刮伤，而且难以被移除。弗洛德STH系列泵可以根据要求精确分配去离子水来湿润氮气保护层。

Once the slurry is mixed, it is imperative that the properties of the slurry are maintained. Recirculation and mixing systems in the slurry tank ensure a homogenous mixture of the ceramic particles, and an inert nitrogen blanket in the tank reduces the possibility of contamination & chemical changes from contact with air.

However, the nitrogen blanket will tend to dry out ceramic particles at the surface of the slurry, as well as on the tank walls. If not for a precision humidification system, ceramic particles would stick together forming larger particles, and would create scratches in the wafer during the CMP process, too large to be removed. Fluid Metering STH Pumps feed deionized water to the system which humidifies the Nitrogen blanket.

 

1. 音响行业—铁磁流体计量

2. 氢燃料电池—液体燃料计量

3. 电子封装—玻璃浆液计量

4. 半导体—化学浆液计量

5. 更多应用

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